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Product Features
Technical Overview
This thermal compound utilizes a metal oxide formulation that enhances thermal transfer efficiency compared to standard pastes. The 60% metal oxide content provides superior conductivity, supporting CPUs with thermal design power (TDP) up to 65W. The paste achieves a thermal resistance of 0.1°C/W, ensuring minimal heat buildup at the interface.
The syringe dispenser allows precise application, reducing mess and ensuring even coverage. Each 1.5g tube provides enough material for 4-6 typical applications, balancing quantity with practicality for routine servicing.
Relevant factors for this section include Thermal Resistance, Thermal Resistance (<), Thermal Conductivity, Color Family. When those points are considered together, they give buyers a clearer picture of how the product is equipped, how it fits into deployment, and what kind of day-to-day role it is meant to support.
Key Product Advantages
StarTech.com thermal paste stands out with its combination of high-performance materials, user-friendly packaging, and professional-grade reliability. The metal oxide formulation offers better thermal conductivity than many standard pastes, directly improving heat sink efficiency.
These strengths make the product easier to deploy and manage in real environments, especially where reliability, usability, and day-to-day operational continuity matter. Notable benefits include Enhanced Heat Transfer, Practical Application Design.
Enhanced Heat Transfer
The silver and metal oxide compound provides 1.93W/m·K thermal conductivity, effectively moving heat away from processors to heatsinks.
- 60% metal oxide content
- Suitable for CPUs up to 65W TDP
- Low 0.1°C/W thermal resistance
Practical Application Design
The re-sealable syringe prevents drying between uses and allows controlled dispensing for clean, efficient application.
- 1.5g sufficient for 4-6 applications
- Precise syringe delivery
- Reduces waste and mess
Deployment / Use Cases
This thermal paste is ideal for IT professionals performing maintenance, upgrades, or repairs on computing hardware. Its reliable performance makes it suitable for desktop workstations, servers, gaming systems, and embedded electronics where effective thermal management is critical.
Common applications include CPU and GPU re-pasting during routine servicing, building or upgrading custom PCs, and maintaining integrated chipsets in industrial or commercial equipment. The wide temperature tolerance ensures consistent performance in varied environments, from data centers to field service scenarios.
IT Maintenance & Servicing
Technicians can use this paste for periodic heat sink reapplication on desktops and servers, ensuring long-term thermal stability.
System Building & Upgrades
PC builders and upgraders benefit from the precise syringe application and reliable thermal performance for new installations.
Physical Profile
The thermal paste comes in a compact syringe measuring 0.79" (20 mm) in height and width, with a depth of 2.64" (67 mm). This small footprint makes it easy to store in toolkits or parts drawers. The silver-colored compound is contained within a re-sealable applicator that protects the material from contamination and drying.
The physical profile is practical for deployment planning because the dimensions and weight are clearly defined: 0.79" (20 mm), 0.79" (20 mm), 2.64" (67 mm), 0.14 oz (4 g). This helps confirm rack, shelf, desk, or cabinet fit before installation.
- Width
- 0.79" (20 mm)
- Depth
- 2.64" (67 mm)
- Height
- 0.79" (20 mm)
- Weight
- 0.14 oz (4 g)
Highlights
- Metal oxide thermal paste with 1.93W/m·K conductivity for efficient heat transfer
- 1.5g re-sealable syringe provides enough compound for 4-6 applications
- Operates reliably from -30°C to 180°C (-22°F to 356°F)
- Silver-based compound with 60% metal oxide content
- CE and RoHS certified for safety and environmental compliance
- TAA compliant for government and institutional procurement
- 2-year limited warranty with technical support
- Compact syringe design for precise, mess-free application
Specifications
| Specifications | |
|---|---|
| Manufacturer | StarTech.com |
| Manufacturer Part Number | SILVGREASE1 |
| Brand Name | StarTech.com |
| Product Name | Metal Oxide Thermal CPU Paste Compound Tube (1.5g) |
| Packaged Quantity | 1 Each |
| Product Type | Thermal Grease |
| Technical Information | |
| Thermal Resistance | 32.2°F/W (0.1°C/W) |
| Thermal Resistance (<) | 32.2°F/W (0.1°C/W) |
| Thermal Conductivity | 1.93W/m?K |
| Dispenser Type | Syringe |
| Minimum Operating Temperature | -22°F (-30°C) |
| Maximum Operating Temperature | 356°F (180°C) |
| Physical Characteristics | |
| Color Family | Silver |
| Product Color | Silver |
| Product Material | Silver,Carbon Compound,Metal Oxide Compound,Silicone Compound |
| Height | 0.79" (20 mm) |
| Width | 0.79" (20 mm) |
| Depth | 2.64" (67 mm) |
| Weight (Approximate) | 0.14 oz (4 g) |
| Miscellaneous | |
| Country of Origin | Taiwan |
| TAA Compliant | Yes |
| Environmentally Friendly | Yes |
| Environmental Certification | EU RoHS |
| Environmental Compliance | Restriction of Hazardous Substances (RoHS) 2,Registration, Evaluation, Authorization and Restriction of Chemicals (REACH) |
| Warranty | |
| Limited Warranty | 2 Year |
User Manual
FAQ
What is the thermal conductivity of this StarTech.com paste?
The StarTech.com SILVGREASE1 thermal paste has a thermal conductivity of 1.93W/m·K. This measurement indicates how effectively the compound transfers heat from the CPU or GPU to the heatsink. Higher conductivity values like this one improve heat dissipation, which is crucial for maintaining optimal processor temperatures and preventing thermal throttling in demanding applications.
How many applications can I get from one 1.5g syringe?
One 1.5g syringe contains enough thermal paste for approximately 4-6 typical applications, depending on the size of the processor and the amount used per application. The re-sealable syringe design helps preserve the remaining compound between uses, preventing drying and waste. This makes it economical for IT professionals who perform multiple maintenance sessions or build several systems.
What temperature range does this thermal paste support?
This thermal paste operates reliably across a wide temperature range from -22°F to 356°F (-30°C to 180°C). This broad tolerance ensures consistent performance in various environments, from cold server rooms to high-temperature gaming systems. The compound maintains its thermal properties throughout this range, providing stable heat transfer under different operating conditions.
What certifications does this thermal compound have?
This thermal paste is CE and RoHS certified, ensuring it meets European safety and environmental standards for hazardous substance restrictions. It is also TAA compliant, making it suitable for government and institutional procurement where Trade Agreements Act compliance is required. These certifications provide assurance of product safety, reliability, and regulatory adherence.
How should I store and handle the thermal paste syringe?
Store the thermal paste syringe in a cool, dry place away from direct sunlight. After use, securely re-seal the syringe cap to prevent the compound from drying out. The syringe design allows for controlled dispensing—apply a small, pea-sized amount to the center of the processor for optimal coverage. Avoid over-application, as excess paste can reduce thermal efficiency.
What connectivity or interface options are available?
Connectivity details help confirm how StarTech.com Thermal Paste, 1.5g Metal Oxide Heat Sink Compound, Re-sealable Syringes, CPU Paste - 1.5g thermal heat paste; Metal - - (SILVGREASE1) can integrate with your network, accessories, and surrounding peripherals before rollout or replacement planning.